Elon Said “FEL FTW.” Here’s the Laser That Will Boost Chip Volumes 50X

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SpaceX Will push to new technology to improve the most important part of TERAFAB. These are the secrets that will enable 50 times more chips by 2030-2035 and the thousands more by 2040-2045.

ASML technology will be taken to the next level.

They only replace and improve the light source, which is about half of the cost the $400-800 million EUV systems. The light source power limits the speed of wafer production.

Elon and Terafab need 10 times to hundreds of times more chips. They will develop the lab with the regular systems and then switch over to the new light when it is ready.

It is like creating super laser light bulbs.

Japan is working to recycle the beam, which would enable going to 10 kilowatt power or about 20X the power of existing ASML machines and 5X the XLight initial goal. The US is trying to shrink the accelerators.

FEL FTW

— Elon Musk (@elonmusk) August 6, 2026

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